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Intel Combo Heatsink for 3rd party chassis Brands - Cliqtosave Online:
Intel BXSTS300C. Suitable for: Processor, Type: Heatsink, Supported processor sockets: LGA 3647 (Socket P). Thermal Design Power (TDP): 280 W. Width: 91 mm, Depth: 88 mm, Height: 64 mm. Package type: Box
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Intel BXSTS300C. Suitable for: Processor, Type: Heatsink, Supported processor sockets: LGA 3647 (Socket P). Thermal Design Power (TDP): 280 W. Width: 91 mm, Depth: 88 mm, Height: 64 mm. Package type: Box
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