Intel Combo Heatsink for 3rd party chassis

R792.00
In stock
SKU
BXSTS300C

Intel BXSTS300C. Suitable for: Processor, Type: Heatsink, Supported processor sockets: LGA 3647 (Socket P). Thermal Design Power (TDP): 280 W. Width: 91 mm, Depth: 88 mm, Height: 64 mm. Package type: Box

More Information
BrandIntel
Tools & Accessories TypeComponents

Intel BXSTS300C. Suitable for: Processor, Type: Heatsink, Supported processor sockets: LGA 3647 (Socket P). Thermal Design Power (TDP): 280 W. Width: 91 mm, Depth: 88 mm, Height: 64 mm. Package type: Box

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